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Results 1 to 25 of 34

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High-Temperature SiC Power Module Electrical Evaluation ProcedurePUQI NING; FRED WANG; NGO, Khai D. T et al.IEEE transactions on power electronics. 2011, Vol 26, Num 11-12, pp 3079-3083, issn 0885-8993, 5 p.Article

Simulation of high-temperature millisecond annealing based on atomistic modeling of boron diffusion/activation in siliconHANE, Masami; IKEZAWA, Takeo; MATSUDA, Tomoko et al.International Electron Devices Meeting. 2004, pp 975-978, isbn 0-7803-8684-1, 1Vol, 4 p.Conference Paper

High temperature getter for compact HID lampsDE MAAGT, B. J; CORAZZA, A.Journal of physics. D, Applied physics (Print). 2005, Vol 38, Num 17, pp 3066-3070, issn 0022-3727, 5 p.Conference Paper

A novel high temperature NMR probe design : application to 17O studies of gel formation of zirconiaPOPLETT, I. J. F; SMITHT, M. E; STRANGE, J. H et al.Measurement science & technology (Print). 2000, Vol 11, Num 12, pp 1703-1707, issn 0957-0233Article

Émaux isolants et fils émaillés = Insulating emails and emailed wiresANTON, Alain.Techniques de l'ingénieur. Génie électrique. 2009, Vol D3, Num D2330, issn 0992-5449, D2330.1-D2330.16Article

Stable Electrical Operation of 6H-SiC JFETs and ICs for Thousands of Hours at 500 °CNEUDECK, Philip G; SPRY, David J; PROKOP, Norman F et al.IEEE electron device letters. 2008, Vol 29, Num 5, pp 456-459, issn 0741-3106, 4 p.Article

Monitoring high-temperature solid-solid phase transitions of HMX with atomic force microscopyWEEKS, Brandon L; RUDDLE, Chantel M; ZAUG, Joseph M et al.Ultramicroscopy. 2002, Vol 93, Num 1, pp 19-23, issn 0304-3991, 5 p.Article

Capacitive pressure sensor with monolithically integrated CMOS readout circuit for high temperature applicationsKASTEN, Klaus; KORDAS, Norbert; KAPPERT, Holger et al.Sensors and actuators. A, Physical. 2002, Vol 97-98, pp 83-87, issn 0924-4247, 5 p.Conference Paper

Stable passivation technique for high-temperature polycrystalline silicon on insulator MOSFETs for MEMS integrationBHAT, K. N; DANIEL, R. J; BHATTACHARYA, E et al.Electronics Letters. 2006, Vol 42, Num 12, pp 721-722, issn 0013-5194, 2 p.Article

Technologische Weiterentwicklung und heutige Qualität im Kraftwerksneubau: Anspruch und Realität = Technological Progress and Current Levels of Quality in the Construction of new Power Plants - Requirements and RealityKEHR, Manfred; THOMAS, Gereon; HARTFIL, Ute et al.VGB powertech. 2010, Vol 90, Num 3, pp 33-37, issn 1435-3199, 5 p.Article

Dynamic calibration of a fine-wire thermocouple using a rocket plume: assessment of the procedureXU QIANG.Measurement science & technology (Print). 2003, Vol 14, Num 8, pp 1381-1386, issn 0957-0233, 6 p.Article

The characterization of Y2O2S:Sm powder as a thermographic phosphor for high temperature applicationsFEIST, J. P; HEYES, A. L.Measurement science & technology (Print). 2000, Vol 11, Num 7, pp 942-947, issn 0957-0233Article

Contacts to GaAs, InP, and GaP for high-temperature and high-power applicationsPIYAWONG LEE, P; HWU, R. J; SADWICK, L. P et al.SPIE proceedings series. 1999, pp 217-222, isbn 0-8194-3281-4Conference Paper

Observation of Normally Distributed Energies for Interface Trap Recovery After Hot-Carrier DegradationPOBEGEN, Gregor; TYAGINOV, Stanislav; NELHIEBEL, Michael et al.IEEE electron device letters. 2013, Vol 34, Num 8, pp 939-941, issn 0741-3106, 3 p.Article

Advantages of HfAlON gate dielectric film for advanced low power CMOS applicationTORIUM, A; IWAMOTO, K; OTA, H et al.Microelectronic engineering. 2005, Vol 80, pp 190-197, issn 0167-9317, 8 p.Conference Paper

On the Distribution of NBTI Time Constants on a Long, Temperature-Accelerated Time ScalePOBEGEN, Gregor; GRASSER, Tibor.I.E.E.E. transactions on electron devices. 2013, Vol 60, Num 7, pp 2148-2155, issn 0018-9383, 8 p.Article

Nanosecond Pulse Generation in a Silicon MicrowireCYWAR, Adam; BAKAN, Gokhan; SILVA, Helena et al.IEEE electron device letters. 2010, Vol 31, Num 12, pp 1362-1364, issn 0741-3106, 3 p.Article

High temperature growth, charge distribution and magnetism in Co and Mn co-doped ZnOFRANCIS, S; SARAVANAN, R; BERCHMANS, L. John et al.Journal of materials science. Materials in electronics. 2013, Vol 24, Num 8, pp 2880-2889, issn 0957-4522, 10 p.Article

Heating microscopy study of the sintering behaviour of glass powder compacts in the binary system SiO2-TiO2KHALIL, Tarek K; BOCCACCINI, Aldo R.Materials letters (General ed.). 2002, Vol 56, Num 3, pp 317-321, issn 0167-577XArticle

A hot gas facility for high-temperature spectrometryCLAUSEN, Sønnik; BAK, Jimmy.Measurement science & technology (Print). 2002, Vol 13, Num 8, pp 1223-1229, issn 0957-0233, 7 p.Article

Pulsed laser deposition of crystalline carbon nitride thin films at high substrate temperatureGUANGSHENG FU; WEI YU; SHUFANG WANG et al.SPIE proceedings series. 2001, pp 201-204, isbn 0-8194-4341-7Conference Paper

Transparent furnace made of heat mirrorKOJIMA, M; TAKAHASHI, F; KINOSHITA, K et al.Thin solid films. 2001, Vol 392, Num 2, pp 349-354, issn 0040-6090Conference Paper

Performance and reliability of InGaN-GaN light-emitting diodes with mirror wafer bonding technologyPENG, W. C; WU, Y. C; LIU, W. H et al.Proceedings - Electrochemical Society. 2005, pp 278-288, issn 0161-6374, isbn 1-56677-462-4, 11 p.Conference Paper

Top-side chip contacts with low temperature joining technique (LTJT)MERTENS, C; RUDZKI, J; SITTIG, R et al.Power electronics specialists conference. 2004, pp 4178-4182, isbn 0-7803-8399-0, 6Vol, 5 p.Conference Paper

Kinetics of high-temperature reaction in titanium-nitrogen system : nonisothermal conditionsTHIERS, Laurent; MUKASYAN, Alexander S; PELEKH, Aleksey et al.Chemical engineering journal (1996). 2001, Vol 82, Num 1-3, pp 303-310, issn 1385-8947Article

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